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Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects

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Soldering & Surface Mount Technology, Volume 27, Issue 1, February 2015.
Purpose As there is more demand in higher I/O, smaller package size and lower cost, flip chip mounted on module level of board is considered. However, bonding large chips (die) to organic module means a larger differential thermal expansion mismatch between the module and the chip. To reduce the thermal stresses and strains at solder joints, a polymer underfill is added to fill the cavity between the chip and module. This procedure has typically at least resulted in an increase of the thermal fatigue life by a factor of 10, as compared to the non-underfilled case. Yet, our particular case is to deal with flip chip mounted both side of PCB module symmetrically (solder bump interconnection with Cu-Pillar). Note that Cu-Pillar bumping is known to possess good electrical properties and better electro migration performance. The drawback is that Cu-Pillar bump can introduce high stress due to the higher stiffness of Cu compared to the solder material. In this study, thus, thermo-mechanical reliability of solder bump with different underfills is assessed with evaluation of different underfill materials. Design/methodology/approach As a reliability assessment, thermal cyclic loading condition was considered in this case. Thermal life prediction was conducted by using finite element analysis (FEA) and modified Darveaux’s model considering micro size of solder bump. Also, thermo-mechanical properties of four different underfill materials were characterized such as Young’s modulus at various temperatures, coefficient of temperature expansion (CTE), and glass transition temperature (Tg). By implementing these properties into FEA, life prediction was accurately achieved and verified with experimental results. Findings The modified life prediction method was successfully adopted for the case of Cu-Pillar bump interconnection in Flip Chip on Module package. Using this method, four different underfill materials were evaluated in terms of material property and affection to the fatigue life. Both predicted life and experimental results are obtained. Originality/value This study introduces the technique to accurately predict thermal fatigue life for such small scale of solder interconnection in newly designed Flip Chip package. In addtion, a guide line of underfill material selection was established by understanding it’s affection to thermo-mechanical reliability of this particular Flip Chip package structure.

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